All-Year-Round Exhibition, Marketing, Lead Generation, and Analytics

All-Year-Round Exhibition

Your online booth will remain active and open all-year-around during all our conferences and free webinars. You will have unlimited direct exhibitor-to-attendee video calls so visitors can meet you live. Even when absent, you still receive leads and analytics.

All-Year-Round Leads 

Engagement with your booth, your talk(s), or your sponsored sessions will bring you leads throughout the year. We work with you to modify our event programme to reach your expected target markets. Our central proposition is annual support of our sponsors

All-Year-Round  Analytics

We provide you with regular analytics on user engagement with your booth, your talk(s), and your sponsored sessions and other contents, giving you quantitative insights to qualify your leads and precisely target your audience.

All-Year-Round

Marketing

Our team organizes 12-14 LIVE online conferences each year on select emerging technologies as well as  bi-weekly free webinars. We also publish regular industry newsletters. All these give you many targeted topic-centric marketing channels. 

All-Year-Round Customer Introductions

Our team and advisors will leverage their global networks throughout the year to make customer or partner introductions, showing you new paths and opening you new doors.

All-Year-Round Learning and Networking 

You and your team will have unlimited all-year-round access to all live and on-demand conferences and masterclasses. You can  also network with industry peers using our searchable networking platform. 
Fill out the form below to download our price list and receive an outline of the virtual exhibition and sponsorship packages

Our All-Year-Around Exhibition and Sponsor Packages

What are our broad focus areas in 2021?

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Electronics, Photovoltaics, Displays, Sensors

Printed, Flexible, Hybrid, Roll-to-Roll, Structural,  3D, Conformal, Large-Area, Stretchable, Textile, Wearable, Patches

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Material Innovations

Energy Storage, Graphene and 2D Materials, Carbon Nanotubes, Quantum Dots, 3D Printing Materials, Energy Harvesting, Thermal Management Materials, Informatics, Low-loss Materials, Light-weighting 

Our Topics in 2021

Novel Electronics

  • Printed Electronics

  • Flexible Electronics

  • Flexible Hybrid Electronics

  • Structural Electronics

  • Electronic Textiles (e-Textiles)

  • Electronic Skin Patches

  • Continuous Health Care Monitoring

  • Roll-to-Roll Electronics

  • Large-Area Electronics

  • OLED Lighting

  • Large-Area LED Lighting

  • Microfluidics

  • HMI and Membrane Switches

  • Printed Logic

  • Thin Flexible IC

  • Organic Photovoltaics

  • Perovskite Photovoltaics

  • Piezoresistive Sensors 

  • Force/Pressure sensors

  • Peizoelectric Sensors and Actuators

  • Haptics

  • RFID and NFC

  • Printed Organic Sensors

  • Hybrid QD or Organic-CMOS Imagers

  • Printed Temperature Sensors

  • Printed OLED

  • Electrochromic Displays

  • Thermochromic Displays

  • Electrophoretic Displays

  • MicroOLEDs

  • MicroLEDs

  • Printed Thin Film Transistors (TFTs)

  • Printed or Flexible Memory

  • Stretchable Strain Sensors

  • Humidity Sensors

  • Gas Sensors

  • Flexible Displays

  • Flexible Polarizers

  • Transparent Heating

  • Transparent Conductive Films 

  • Thin Film Encapsulation

  • Flexible Barriers

  • Solid State Battery

  • Si Anode Battery

  • LiS Battery

Advanced Materials

  • Peroviskites

  • Graphene

  • 2D Materials

  • Carbon Nanotubes

  • Quantum Dots

  • Novel dyes

  • Narrowband Phosphors

  • Si Anode

  • Graphite (Natural, Synthetic, Coated Purified)

  • Solid State Battery Electrolyte (e.g., LiPON, LLZO, LATP, LGPS)

  • Activated Carbon

  • LCO and LFP

  • NMC, NCA and LM

  • OLED

  • TADF (Thermally Activated Delayed Fluorescence)

  • Organic Semiconductors

  • Solution processed IGZO

  • Lithium Metal

  • Metal Sintered Die Attach

  • Low Temperature Solder

  • Anisotropic Conductive Adhesives

  • Isotropic Conductive Adhesives

  • Thermal Interface Materials

  • Vertically Aligned CNTs

  • 3D Printing Metal

  • 3D Printing Materials (Photosensitive Resins, Thermoplastic Powders/Filaments, Ceramic Powders)

  • Thermoelectronics

  • Material Informatics

  • Low-loss PTFE

  • Low-loss modified PI

  • Low-loss LCP

  • Particle-free Inks

  • Nanoparticle Inks

  • Stretchable Inks

  • Copper, Gold,  or Silver-Copper Inks

  • LTPS

  • Aerogels

  • Carbon Inks

  • UV Curable Dielectrics

  • HTL/ETL

  • ALD (Atomic Layer Deposition) Precursors

  • Boron Nitride 

  • SiC

  • clear PI and  Other Flexible Substrates

  • Dispersents

Processes

  • InMold Electronics

  • Inkjet Printing

  • Aerosol Deposition

  • Laser Direct Sturcturing (LDS)

  • Transparent Electronics

  • Spatial ALD

  • Roll-to-Roll Electronics

  • Electrohydrodynamic

  • Spraying

  • Pick-and-place

  • Stamping/Transfer Pritning

  • 3D Printing

  • Nanoprinting

  • Flex printing

  • Gravure Printing

  • Thermal Sintering/Curing

  • Photonic Sintering/Curing

  • SMTs (surface mount technology)

  • Inspection

  • Evaporation 

  • Sputtering

  • Ultrapreicison Printing

  • Wafer Printing

  • Vapor Jetting and Spraying

  • Plating

  • Dispensing

  • Stencil Printing

CONTACT US

Address: Arndtstrasse, 47, Frankfurt a.M, 60325, Germany

Tel:        +49 17661704139

​Email:    chris@techblick.com

TechBlick is owned and operated by KGH Concepts GmbH with registration number HRB 121362

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© 2020 by KGH Concepts GmbH