ALL PAST & FUTURE EVENTS AS WELL AS MASTERCLASSES WITH A SINGLE ANNUAL PASS
Printed, Flexible, Hybrid, & InMold Electronics
10-11 March 2021
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Topics Covered
Printed | Flexible | Additive | Hybrid | 3D | Structural | R2R | InMold
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Full Agenda
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Coming Soon

10 March 2021
JCDecaux
Wednesday
Technologies For Out-Of-Home & New Applications
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02:10pm

Technologies For Out-Of-Home & New Applications
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02:10pm

10 March 2021
GE Research
Wednesday
Flexible Hybrid Electronics Applications for the Industrial World
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02:30pm


Nancy Stoffel
Platform Leader for FHE at GE
This presentation overviews GE’s vision of the digital industrial challenges in manufacturing. It does this in the context of opportunities for sensors, and communication elements made using flexible hybrid electronics, for smart manufacturing, structural health monitoring, and for improved worker safety and productivity.
Nancy Stoffel
Platform Leader for FHE @ GE Research
Bio
Nancy Stoffel specializes in design and manufacturing of printed embedded systems and electronics packaging. She serves as GE’s representative on the Nextflex consortia Board of Governors and was recognized for her technical contributions by being named a Next Flex Fellow. Nancy holds a PhD in Materials Science from Cornell University. Her career has focused on materials and process development for electronics integration. During her 30+ industry career, she was Director of Microsystems Integration at STC MEMS & Technical Manager at Xerox Corp in-charge of inkjet device fluidic design, materials technology and process development for next generation product. During her time at IBM she developed new materials and process technology to create co-fired glass-ceramic multichip modules. She has been with GE Research for 9 years where her work has focused on the integration of sensors and electronics for power electronics, wearables and asset monitoring. She is active in the IEEE, and is the 2021 General Chair of the IEEE ECTC, the premier electronics packaging conference.
Flexible Hybrid Electro, All, Printed Electronics, Sensors
Flexible Hybrid Electronics Applications for the Industrial World
More Details
02:30pm
This presentation overviews GE’s vision of the digital industrial challenges in manufacturing. It does this in the context of opportunities for sensors, and communication elements made using flexible hybrid electronics, for smart manufacturing, structural health monitoring, and for improved worker safety and productivity.
Nancy Stoffel
Platform Leader for FHE @ GE Research
Bio
Nancy Stoffel specializes in design and manufacturing of printed embedded systems and electronics packaging. She serves as GE’s representative on the Nextflex consortia Board of Governors and was recognized for her technical contributions by being named a Next Flex Fellow. Nancy holds a PhD in Materials Science from Cornell University. Her career has focused on materials and process development for electronics integration. During her 30+ industry career, she was Director of Microsystems Integration at STC MEMS & Technical Manager at Xerox Corp in-charge of inkjet device fluidic design, materials technology and process development for next generation product. During her time at IBM she developed new materials and process technology to create co-fired glass-ceramic multichip modules. She has been with GE Research for 9 years where her work has focused on the integration of sensors and electronics for power electronics, wearables and asset monitoring. She is active in the IEEE, and is the 2021 General Chair of the IEEE ECTC, the premier electronics packaging conference.

10 March 2021
FIAT Research Centre
Wednesday
Materials Meets Electronics: A New Paradigm for Automotive Components
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02:50pm
