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Innovations Festival: Printed, Hybrid, 3D, InMold, Textile Electronics
24 June 2022
Networking Lounge
Topics Covered
This must-attend one-day Innovations Festival showcases exciting and cutting-edge advances from across the world. It brings together more than 400+ participants, 45 speakers and 55+ live exhibitors. The audience is truly global, coming together across many different time zones.
This is a truly unique gathering in our special 'in-person virtual' platform, which makes virtual interaction real and enables spontaneous discussions, serendipitous meetings, and excellent networking. We promise- in many ways it is more effective and more fun than onsite in-person interactions.
R2R Nanolithography | Nano-Scale Wafer Printing | Smart Skin Patches | 3D Touch Surfaces | Quantum Dots | Stretchable Liquid Metal Inks | Jet Metallization | Laser Induced Forward Transfer | Fuel Cells | Printed Batteries | Organic Photovoltaics | R2R PCB Production | Hybrid Circuits | 3D Electronics | InMold Electronics | Smart Surfaces | Ultra Fine Line Printing | Novel Interconnect Technology | E-Textiles | Printed Displays | Printed Sensors | Printed Sensors | Innovative Paste Technologies | Smart Packaging | Additively Manufactured Electronics | OTFTs | Perovskites
You can participate in the Festival of Innovations on 24 June for just 50 Euros.
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To join the Festival click on the Register Now button above.
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Leading global speakers include:
Full Agenda
The times below is Central European Times (CET).
On the platform the times will automatically be changed to your time zone
Coming Soon
24 June 2022
Komori Corp
Friday
Micro bumps by gravure offset printing method
More Details
2.00PM
Chisato Oyama
We examined to utilize the gravure offset printing method to print high-precision micro bumps with various pastes.
For the flux paste, the precision of the printing position was ±5 μm on a 300 mm wafer.
We have also tried to print and reflow the solder paste.
Printing and reflow have been successful with minimum diameter of 6 μm and 15 μm, respectively.
We will report the details on the day.
Micro bumps by gravure offset printing method
More Details
2.00PM
We examined to utilize the gravure offset printing method to print high-precision micro bumps with various pastes.
For the flux paste, the precision of the printing position was ±5 μm on a 300 mm wafer.
We have also tried to print and reflow the solder paste.
Printing and reflow have been successful with minimum diameter of 6 μm and 15 μm, respectively.
We will report the details on the day.
24 June 2022
Zinergy UK
Friday
Printed Batteries: Towards R2R Scale-up
More Details
2:05PM
Dilek Ozgit Butler
Co-Founder and Chief Scientific Officer
All, Printed Electronics