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Innovations Festival: Printed, Hybrid, 3D, InMold, Textile Electronics

24 June 2022
Networking Lounge

Topics Covered

This must-attend one-day Innovations Festival showcases exciting and cutting-edge advances from across the world. It brings together more than 400+ participants, 45 speakers and 55+ live exhibitors. The audience is truly global, coming together across many different time zones.

This is a truly unique gathering in our special 'in-person virtual' platform, which makes virtual interaction real and enables spontaneous discussions, serendipitous meetings, and excellent networking. We promise- in many ways it is more effective and more fun than onsite in-person interactions.

R2R Nanolithography | Nano-Scale Wafer Printing | Smart Skin Patches | 3D Touch Surfaces | Quantum Dots | Stretchable Liquid Metal Inks | Jet Metallization | Laser Induced Forward Transfer | Fuel Cells | Printed Batteries | Organic Photovoltaics | R2R PCB Production | Hybrid Circuits | 3D Electronics | InMold Electronics | Smart Surfaces | Ultra Fine Line Printing | Novel Interconnect Technology | E-Textiles | Printed Displays | Printed Sensors | Printed Sensors | Innovative Paste Technologies | Smart Packaging | Additively Manufactured Electronics | OTFTs | Perovskites

You can participate in the Festival of Innovations on 24 June for just 50 Euros.
This is a monthly subscription which can be cancelled at any time.
To join the Festival click on the Register Now button above.

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Leading global speakers include:

Full Agenda

The times below is Central European Times (CET).

On the platform the times will automatically be changed to your time zone

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24 June 2022

Komori Corp

Friday

Micro bumps by gravure offset printing method

More Details

2.00PM

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Chisato Oyama

We examined to utilize the gravure offset printing method to print high-precision micro bumps with various pastes.
For the flux paste, the precision of the printing position was ±5 μm on a 300 mm wafer.
We have also tried to print and reflow the solder paste.
Printing and reflow have been successful with minimum diameter of 6 μm and 15 μm, respectively.
We will report the details on the day.

Micro bumps by gravure offset printing method

More Details

2.00PM

We examined to utilize the gravure offset printing method to print high-precision micro bumps with various pastes.
For the flux paste, the precision of the printing position was ±5 μm on a 300 mm wafer.
We have also tried to print and reflow the solder paste.
Printing and reflow have been successful with minimum diameter of 6 μm and 15 μm, respectively.
We will report the details on the day.

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24 June 2022

Zinergy UK

Friday

Printed Batteries: Towards R2R Scale-up

More Details

2:05PM

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Dilek Ozgit Butler

Co-Founder and Chief Scientific Officer

All, Printed Electronics