Printed, Hybrid, Structural, & 3D Electronics

MAY 2021

5 Minute preview of all the event presentations

Topics Covered

Printed | Hybrid | Structural | 3D Electronics

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Anurag Bansal

ACCIONA

Anurag Bansal

ACCIONA

LEE-BED: Services and infrastructure within printed and embedded electronics

Bio

Anurag Bansal has more than twenty-two years of experience within international construction, polymers and chemical companies.
During this tenure, he has worked in different areas of Composites-product value-chain for example, product and process development, manufacturing, supply chain management including sourcing and outsourcing, business development including key-customer coordination and product portfolio management, technology intelligence and transfer and, production facility setup.
Currently, he is also collaborating, among several other projects, in devlopment of LEE-BED’s wireless sensor technology, by sharing his expertise in composites product manufacturing, logistics and installation in construction industry.

Mike Mastropietro

ACI Materials

Mike Mastropietro

VP of Engineering

ACI Materials

ACI Alchemy Conductive Inks -Enabling Next Generation Flexible & 3D Electronics

ACI will introduce to the world its Alchemy Conductive Inks. These high-performance printable conductors allow PTF ink like ease of use and processing with fired/sintered thick film electrical performance. The talk will describe some of the overall benefits of using these materials in manufacture of flexible and 3D printed electronics including:
low volume resistivity and sheet resistance
higher current carrying capacity
lower cost per ohm square in use
superior crease ability of narrow traces
formulation latitude from viscous paste to sprayable
Several examples will be presented including
3D circuit structures
high resolution traces
high power density busbars
reflow solder ability

 Jedrzej Kufel

ARM

Jedrzej Kufel

Staff Research Engineer

ARM

Towards Natively Flexible ICs

Conventional silicon technology has embedded at least one integrated circuit into every smart device on Earth. However, it faces key challenges to make everyday objects smarter. Cost is the most important factor but flexibility and conformability are highly desirable.
Our approach is to develop integrated circuits using flexible electronic fabrication techniques, thus paving the way towards natively-flexible LSI and VLSI ICs.

Jedrzej Kufel
Staff Research Engineer @ Arm
Bio

Dr Jedrzej Kufel is a Staff Research Engineer. He joined Arm in 2014, working in the IoT product team before moving to Research in 2016. His current interests are in the area of low-power integrated circuit design using flexible/printed electronics, validation and test methodologies and circular economy. Jedrzej holds a MEng in Mechatronics and Robotic Systems from University of Liverpool and a PhD from University of Southampton.

Frank Louwet

Agfa

Frank Louwet

Global Marketing Manager - PE

Agfa

Printed Electronics made with Digital Printing: Materials and Applications in Motor Sport

Digital printing has clearly established itself for graphics printing, thanks to the advantages it offers over traditional processes like screen printing. More recently, digital printing started morphing into digital manufacturing and also Printed Electronics is taking advantage of that evolution. In this talk we will review Agfa's digital conductive inks based on nanomaterials, and highlight some features of newly developed inks. In the second part of the talk, Nanogate Netherlands will discuss the application of additive digital manufacturing in motor sport products.

Peter Willaert
Global Marketing Manager Printed Electronics @ Agfa
Bio

Experienced Product Marketing and Business Development Manager in Printed Electronics with a background in Electronic Engineering. Over the years I have developed a broad knowledge about materials and processes for applications like RFID, iOT, Sensors, Displays etc.

Dennis Hahn

Airbus Operations GmBH

Dennis Hahn

Project Leader, Printed Electronics

Airbus Operations GmBH

End User Panel Discussion: Printed Electronics in Aviation

Rahul Raut

Alpha Assembly

Rahul Raut

Director, Strategy and Technology Acquisitio

Alpha Assembly

Ultralow Temperature Solder For Flexible Hybrid Electronics

Doug Hackler

American Semiconductor

Doug Hackler

CEO

American Semiconductor

State-of-the-Art and Issues for Bluetooth® Flexible Hybrid Electronics (FHE)

Bio

Douglas Hackler, Co-founder of American Semiconductor 2001. 30+ years of experience in wafer fabrication, process development, manufacturing and commercialization at M/A-Com, Zilog, Intel, NorTel and General Instrument. Engineering degrees from Boise State University (BSEE) and the University of Idaho (MSEE). Business degree from Texas Tech University (BBA). Doug has multiple patents and patents pending for advanced packaging and flexible technology and has published numerous technical papers. At American Semiconductor Doug maintains overall corporate and operational responsibilities.

Francesca Antoniolli

Applied Materials

Francesca Antoniolli

Global Product Manager

Applied Materials

Advanced screen printing for PE: two case studies of industrial applications in medical and display

Bio

After completing the Material Engineering studies in 2004, Francesca decided to pursue the Academic career by undertaking a PhD in Material Science and Engineering, with main focus on nano and bio technologies. In parallel established a 5 years collaboration with the Dentistry Department in order to increase the knowledge and awareness about dental materials in this sector.
In 2008 decided to leave the Academic path to jump into the entrepreneurial adventure and joining full-time the start-up Genefinity, a spin-off of the University of Trieste, which she founded in 2005 together with 3 other PhD colleagues. The company grew successfully for about 10 years by developing specific competences on thin films depositions, mainly PVD and ALD techniques, with main markets biomedical, food, solar and cosmetic.
In 2016, decided to jump into a new adventure and joined Applied Materials Italy as Business Developer, with the main target to expand the current solar market to other sector of the printed electronics.

Adam Scotch

Brewer Science

Adam Scotch

Tech Leader

Brewer Science

Printed Smart Devices: Enabling Widespread, Real-Time Sensing

Bio

Dr. Adam M. Scotch is currently Director of R&D, Smart Devices and Printed Electronics at Brewer Science in Springfield, MO. Prior to joining Brewer Science, Adam was Director of Manufacturing at antenna tech start-up Wafer for 3.5 years, responsible for product development, engineering, scale to manufacturing, and general operations. Adam held various technical leadership roles over 13 years in R&D at lighting company OSRAM, and lead the company’s efforts in printed electronics. His expertise is in materials science, process development, LED devices, and packaging. Prior to OSRAM, he was a National Research Council Postdoctoral Fellow at the National Institute of Standards and Technology (NIST). He holds 20 U.S. Patents and 9 refereed journal publications. Adam has a B.S. and Ph.D. in Materials Science and Engineering from Lehigh University, Bethlehem, PA.

Jean-Rémi Pouliot

Brilliant Matters

Jean-Rémi Pouliot

CEO

Brilliant Matters

New Generation Of Photovoltaic Materials

Ajay Virkar

C3Nano

Ajay Virkar

Co-Founder and CTO

C3Nano

Platform Optoelectronic Materials: Flexible, Rollable, Large-Area, Biotech & Beyond

Jean-Charles Souriau

CEA

Jean-Charles Souriau

Project Leader

CEA

Ultrathin Flexible ICs For Flexible Electronics

ChipInFlex is CEA-Leti's latest development towards the integration of ultra-thin, bare silicon chips within a flexible film. Today, electronic systems are becoming smaller, thinner and, above all, flexible. Flexibility makes possible new functions and hence new usages. With Chip-In-Flex, CEA-Leti is introducing a new paradigm for integrating ultra-thin, bare chips into a flexible label made on a silicon wafer.

Thomas Kolbusch

COATEMA Coating Machinery GmbH

Thomas Kolbusch

Vice President

COATEMA Coating Machinery GmbH

Improvement of yield and performance of OPV by using inline quality control systems and process monitoring

Coatema delivered a pilot line in 2012 to the University of Thessaloniki in Greece. (Auth). Since them there had been a continuous scale up of the system with the integration of different quality control systems like inline spectroscopy and others. In a new European project called Real Nano additional quality control systems are being installed.
The talk describes the used systems, the influence of the different parameters like coating, drying, tension control and others.

Thomas Kolbusch
Vice President @ Coatema® Coating Machinery GmbH
Bio

Thomas Kolbusch is Vice President of Coatema Coating Machinery GmbH, an equipment manufacturing company for coating, printing and laminating solutions located in Dormagen, Germany.
He is member of the board of the OE-A (Organic Electronic Association) in Germany, a global association for printed electronics.
He serves in the advisory board of Fraunhofer ITA institute.
He served as member of the board of COPT.NRW, a local association in Germany, as well as exhibition chair of the LOPEC in Munich for five years. Thomas is active in the field of fuel cells, batteries, printed electronics, photovoltaics and medical applications. He organizes the international Coatema Coating Symposium for over 19 years and represents Coatema in a number of public funded German and European projects. Thomas Kolbusch studied Business Economics at the Niederrhein University of Applied Sciences and got his degree as business economist in 1997. He started his career at 3M, Germany. Since 1999 he is working for Coatema Coating Machinery in different positions.

Steven Bagshaw

CPI

Steven Bagshaw

Business Development Manager

CPI

Applications Utilising Roll to Roll Fexible Hybrid Electronics

Bio

Steve is responsible for business development activities across CPI’s printed electronics platform. Steve’s expertise lies in the area of printed electronics, printed sensing and its role in the development of the internet of things and industry 4.0. Steve has delivered on a number of successful private projects at CPI, helping new research ideas develop from prototype and through to commercial deployment. Clients include industries such as automotive, aerospace, defence, packaging and medtech. These projects involve working with companies of all sizes ranging from large corporates to SMEs and academia.

Previously Steve held marketing positions at CPI, where he was responsible for managing the marketing operations of CPI’s printable electronics division. Steve’s role was to provide an end user focus in the scale up and commercialisation of products and processes related to printable electronics. He has extensive knowledge in emerging technology areas such as intelligent print, printed lighting and enabling technologies such as materials integration and barrier encapsulation.

Prior to joining CPI in 2008, Steve graduated from Northumbria University in Business Studies and is currently studying an Executive MBA at Warwick Business School.

Pål Morten Lindberget

CondAlign AS

Pål Morten Lindberget

VP Sales and Marketing

CondAlign AS

Advantages With Anisotropic Conductive Adhesive Films Comprising Aligned Particles

CondAlign’s technology represents a novel process for production of anisotropic, conductive films. Using an electric field to structure and align particles, the results in a z-axis conductive film structure. One product type we can produce is anisotropic conductive adhesive (ACA) films with thicknesses from a few µm to some hundreds µm and resistance below 0,01 Ohm/cm^2. With very high chain densities (pitch below 10µm), these films are currently being tested in several bonding processes, like FOB, FOF, COB, COF, as an alternative to traditional ACF. The process is demonstrated in roll-to-roll production, proofing it is scalable and cost effective.

Morten Lindberget
VP Business Development @ CondAlign
Bio

An enabler with 25 years international experience from leadership, sales and business development roles in technology consulting, contract manufacturing, medical device technology and scale up. Morten holds a MSc in Mech. Engineering from TU Delft, the Netherlands, and an Executive Master of Management from BI, Norway.

Zachary J. Davis

Danish Technological Institute

Zachary J. Davis

Team Manager

Danish Technological Institute

LEE-BED: Services and infrastructure within printed and embedded electronics

Bio

MSc. in Applied Physics, PhD. in Electrical Engineering. Have worked with micro and nano electromechanical systems and sensors and printed electronic technologies for the last 20 years.

Scott Gordon

DuPont Teijin Films

Scott Gordon

New Business Development Manager

DuPont  Teijin Films

Advances in Polyester Film Substrates for Flexible Electronics

Continued advances in Flexible Hybrid Electronics have required material suppliers to deliver improved functionality to the device developers in broad applications such as sensors, displays, barrier films, photovoltaics, medical diagnostics, consumer electronics, HMI (Human Machine Interface), and Flexible Printed Circuits (FPCs).
Demands on the film substrate suppliers can vary widely, and polymer property requirements typically include: clean surfaces with low surface defects, optically clear films with low haze and iridescence, near zero thermal shrinkage for multilayer print registration and component attach via solder reflow, UV and Hydrolysis resistance, and VTM-0 Flame Retardance. Many requests also include an ability to further tailor the surface chemistry to improve and enhance the downstream processing performance. New commercial polyester film types have been introduced by DuPont Teijin Films, and their typical end use applications will be described.

Fraunhofer FEP performs Roll-to-Roll film processing, and they are developing transparent and robust permeation Barrier Films for Flexible Electronics. The substrate choice is critical for optimized performance, and Fraunhofer FEP will describe their journey and key learnings.

Julie Ferrigno

E2ip Technologies

Julie Ferrigno

R&D Engineer