Printed, Hybrid, Structural, & 3D Electronics

11-12 May 2021
Virtual Event Platform

Topics Covered

Printed | Hybrid | Structural | 3D Electronics

Confirmed speakers:

COMING SOON

Phillips 66
The Coca-Cola Company
Parsons
Alpha Assembly
ACCIONA
META (Metamaterial)
C3Nano
E2ip Technologies
SUNEW
ARM
Airbus Operations GmBH
Texas Instruments
XTPL
Brewer Science
Sheldahl Flexible Technologies
Nano OPS
PolyIC
National Research Council Canada (NRCC)
Panasonic Electronic Materials
IDENTIVE
Wuerth
CEA
Ntrium
SAFI-Tech
Kundisch GmbH & Co. KG
Nanogate
Procter & Gamble
KIMOTO
COATEMA Coating Machinery GmbH
Brilliant Matters
Agfa
VSParticle
VTT
Prismade Labs GmbH
U.S. Army Combat Capabilities Development Command
DuPont  Teijin Films
Fraunhofer FEP
ENJET Inc
NovaCentrix
CPI
Danish Technological Institute
IDS Inc
The Boeing Company
Signify
American Semiconductor
Applied Materials
Hewlett Packard
CondAlign AS
ACI Materials
Smooth & Sharp Corporation
Gradient_edited_edited.jpg
Here is how the LIVE 'In-Person Virtual' networking & exhibition works.
Watch the Demo Below