Electronics Packaging Symposium: AI Chips, 5G Packaging, Chiplets etc

4-5 November 2021
Virtual Event Platform

This is a virtual symposium with live presentations. Binghamton University State University of New York

Topics Covered

This event will be available as on-demand talks only. This was originally organized by the Integrated Electronics Engineering Center (IEEC) of Binghamton University. Topics covered include Future of Semiconductor Technology | Heterogeneous Integration | AI Hardware | Supercomputers | Quantum Computing | On-Package Integration | Panel Level Packaging | Chiplets and Die Block Assembly | 5G Architectures and Packaging| Materials for Neuromorphic Computing | Photonic Packaging | Printed Microwave Packaging | Future of Semiconductors | High Density Fan-Out Packages | Chiplets and SiP | Liquid Metal | 3D Printed Electronics | Printed Electronics | Energy Storage E-Textiles | Interconnects and Die Attach Technologies | Scaling in interconnects | E-Textiles | Wearable Sensors

Confirmed speakers:

COMING SOON

GE Research
Corning Incorporated
US Army Research Laboratory
IBM
Georgia Institute of Technology
Fraunhofer IZM
IBM Research
Defense Advanced Research Projects Agency (DARPA)
NC State University
NC State University
Rochester Institute of Technology
Łukasiewicz - ITR
ASE
Prismark Partners
NSWC Crane Division
NSWC Crane Division
University of Minnesota
Binghamton University
ASE
HP Labs
IBM
GE Research
Fraunhofer IZM
Raytheon Missiles and Defense Systems
Griffis AF Base
SUNY Polytechnic Institute
Binghamton University
Tampere University of Technology
Lockheed Martin
Intel
Auburn
Binghamton University
University at Buffalo
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