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Digital & 3D Additive Manufacturing of Electronics, Sensors, Photovoltaics, Displays, etc

29-30 March 2023
Virtual Event

TechBlick’s event on 29-30 March 2023 focuses on all technology and applications aspects of digital and 3D additive manufacturing electronics. It is a unique curated event covering the full spectrum of manufacturing technologies, frontier innovations, and existing and emerging applications from around the world. The event uniquely brings together material suppliers, technology developers, equipment manufacturers, and OEMs.

On the technology front we will cover all the key technologies of the present and future including inkjet, microdispensing, direct wiring, direct plating, aerosol, jetting and spraying, aerosol, electrohydrodynamic printing, laser induced forward transfer, etc.

The technology will be covered for both flat 2D, 2.5, and even free form 3D printing on complex 3D objects. The agenda will cover printing of all manners of functional materials including conductive materials, ceramics, quantum dots, OLEDs, high--frequency insulators,
PEDOT, organic semiconductor, solder resist, high viscosity pastes, and many more.

On the application side we seek to cover most key existing and emerging applications including photovoltaics, mmWave devices, OLEDs, QD-OLED, QLEDs, photodetectors and LEDs, quantum dots, antennas, functional 3D devices, circuits, PCBs, EMI shielding, semiconductor packaging, microLEDs, batteries, and beyond.

This conference focuses also on advancing the art, addressing long-standing technical limitations, and pushing forward manufacturing technologies. It is a must-attend event for those interested in digital and 3D additive manufacture of electronics.

Themes: Inkjet | Aerosol | Electrohydrodynamic Printing | Advanced Dispensing | 3D Printing | LIFT | MID | LDS | Selective Plasma | Digital Plating | Direct Wire | Robotic Platforms | Ink-Less Printing | Path Planning and Control | Selective Jetting | Lighting | 3D Printed Electronics | PCB Production | Semiconductor Packaging | EMI Shielding | Microwave and mmWave Devices | Semiconductor Production | Photovoltaics | Photodetectors | Quantum Dots | QLEDs | OLED-QLED | MicroLEDs | Circuit and/or PCB Design and Prototyping | Ceramic (HTCC/LTCC) | Batteries | and Many More

Confirmed speakers:

COMING SOON

FUJI CORPORATION
Nanyang Technological University
Syenta
HighLine Technology
IMTEK - University of Freiburg
Trinity College Dublin
University of Michigan
J.A.M.E.S GmbH
FUJIFILM Dimatix
Quantica
Domicro
North Carolina State University
Dracula Technologies
Cicor Group
Exaddon
Electroninks
Fraunhofer IAP
Lithoz
Grenoble INP-Pagora
Notion Systems
Fraunhofer ENAS
University of Texas
Elephantech
Neotech AMT
Ntrium
NRCC
ImageXpert
FTMC
Centre de Transfert de Technologies Ceramiques
Humboldt-Universität zu Berlin -
Karlsruhe Institute of Technology (KIT)
Aix-Marseille Université
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Here is how the LIVE 'In-Person Virtual' networking & exhibition works.
Watch the Demo Below
Networking Demo
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